Xi'an Yicai is a leading enterprise in China's semiconductor silicon wafer sector, focusing on the R&D, production and sales of 12-inch silicon wafers – the core foundational material for chip manufacturing. The company has established a core technology system covering five major process links: crystal growth, shaping, polishing, cleaning and epitaxy, with its core indicators reaching globally leading levels. Its products are widely used in the mass production of multiple types of chips, including memory chips, logic chips and CIS chips, ultimately serving various intelligent terminals in the AI era such as smartphones, personal computers, data centers, smart cars and robots. By the end of 2024, Xi'an Yicai ranked first in mainland China and sixth globally in terms of 12-inch silicon wafer shipment volume and production capacity scale. According to the prospectus, Xi'an Yicai plans to raise RMB 4.9 billion in this IPO, which will be fully invested in the Phase II Project of Xi'an ESWIN Silicon Industry Base. The completion of this project will form a better scale effect together with the first factory, helping the company optimize its product structure, enhance its technological strength, accelerate the expansion of overseas markets, and further improve its competitiveness and market share in the global semiconductor industry chain.

Source: Fund Department, Wang Yanan
Review: Xue Yao
Release: You Yi