Recently, Jiangsu Xinde Semiconductor Technology Co., Ltd. (hereinafter referred to as "Xinde Semiconductor"), a direct-investment enterprise of the Venture Capital Group, announced the completion of a financing round worth nearly 400 million yuan. The round was co-led by municipal and district-level institutions in Nanjing, with follow-up investments from Jiangsu Nanjing Advanced Manufacturing Industry Special Master Fund, Yuanhe Puhua, and Yushan Capital. The funds raised in this financing round will be mainly used to further accelerate the deployment of R&D and production of high-end packaging and testing technologies, including SiP (System-in-Package), FOWLP (Fan-Out Wafer-Level Packaging), Chiplet-2.5D/3D, and heterogeneous packaging modules.

Founded in 2020, Xinde Semiconductor was established under the leadership of a leader in semiconductor packaging and testing technology. It has taken the industry-scarce Bumping and flip-chip process resources as the entry point, and built cutting-edge high-end technology platforms such as 2.5/3D, TGV (Through Glass Via), TMV (Through Mold Via), LPDDR-storage, and optical sensing (CPO, Co-packaged Optics). As a leading enterprise in medium-to-high-end packaging and testing that is rooted in Nanjing and radiates across the country, Xinde Semiconductor has become a core force in the advanced packaging field by virtue of its top-tier technical team, comprehensive technology layout, and rapid growth momentum. This investment will help the company accelerate the breakthrough of high-end packaging technology barriers and inject strong impetus into the independent and controllable development of the industrial chain.

As a core force in the "4+N" industrial fund cluster, Nanjing Venture Capital Group has always focused on strategic tracks such as semiconductors. The person in charge of the 5th Investment Department of the Venture Capital Group stated that the Venture Capital Group had already participated in the Series A financing of Xinde Semiconductor in 2021. This time, when Nanjing Major Project Fund and Jiangsu Strategic Emerging Industry Fund invest in Xinde Semiconductor, they not only value its technical accumulation and growth potential in the field of advanced packaging, but also aim to empower it through capital to become a key supporter for the leap in chip performance in the "post-Moore era". In the future, the two parties will work together to build a more complete industrial chain ecosystem, help Nanjing build a national-leading highland for the semiconductor packaging and testing industry, and contribute the "Xinde strength" to accelerating domestic substitution!