Wang Changrui, Founder and Chairman of Ruiwei New Materials, stated that he is honored to join hands with investors to contribute to the vigorous development of Ruiwei New Materials. The participation of these top-tier investment institutions not only provides solid financial support for the company's development, but also brings international management experience and forward-looking industry insights. This helps the company achieve scientific management and transparent operations, while also providing in-depth empowerment for its business development. In the future, Ruiwei New Materials will not only be satisfied with being a provider of high-performance materials, but will also strive to become a leader in thermal management solutions. It will focus on developing high-performance and high-reliability thermal management materials, and integrate advanced materials science, thermodynamics research, precision manufacturing processes, customized services, and strict performance testing to provide one-stop and innovative thermal management solutions for the severe thermal challenges faced by the electronics industry, leading the industry to new heights.

Hu Yong, General Manager of the 5th Investment Department of Nanjing Innovation Investment Group, said that the company focuses on the field of diamond-copper/aluminum heat sink materials. With the continuous growth of demand for high-performance heat sink materials in China, as well as the continuous improvement of the technical maturity of diamond heat sink products and further cost reduction, the future market prospect will be broader. The company's core team has been deeply engaged in the diamond-copper/aluminum composite material industry for many years, with a profound understanding of downstream application fields. Its products have been introduced to key customers and verified by the market, giving it a certain first-mover advantage. In the future, Ruiwei New Materials will not only manufacture functional products, but also focus on the thermal management field to produce more complex packaging and integrated products. Through systematic thermal design, structural design, thermal simulation analysis, customized development, and comprehensive thermal testing, it will provide full-chain thermal management solutions for chip thermal management issues.